Replacement of the dry scrubber absorber and repair of the ACP-28 roots pump

Atomic layer deposition (ALD) is a thin film deposition technique based on sequential, self-limiting chemical reactions of precursors on surfaces. Plasma-enhanced ALD (PE-ALD) increases surface reactivity, enabling conformal coatings on complex structures at moderate temperatures. Applications include semiconductor device fabrication, high-aspect-ratio nanostructure coatings, 2D materials synthesis, and Bragg reflector optical coatings.

The upgrade includes:

• Replacement of the exhaust absorber for safe neutralization of process gases.

• Repair of the ACP 28 roots pump to restore vacuum integrity.

Key benefits:

• Ensures safe and uninterrupted operation of the ALD system.
• Maintains high-quality deposition for collaborative MAPEX research projects.
• Supports advanced applications including photocatalysis, optical coatings and 2D materials.

Features:

• PE-ALD capability for a wide range of oxide, nitride and sulphide materials.
• Dry scrubbing system for chemical safety.
• High vacuum connectivity to MBE and XPS systems for integrated processing and analysis.

Applied by:

Dr. Manuel Alonso-Orts (AG Eickhoff, IFP)