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MAPEX Instrument Database

X-ray CT

General information

Description
Röntgen-Computer-Tomograph
Manufacturer
GE
Location
--
BIAS
NDT FZB BIAS
Category
---
MAPEX Category
Material Properties, Dimensional Properties, Surface / Interface Characterization
Keywords
X-CT, R-CT, NDT, 3D-shape, defects, XCT, CT
Measured Quantity
3D-shape; defects; interfaces; volume
Main Application
Non destructive testing (NDT) of metals, compound materials, otpo-electronic components etc.
Features
two X-ray sources: micro- and nano focus (sub µm resolution)
Year of Fabrication
2014

Instrument specification

Specifications

Component size

•        Max. object size: (height x diameter) 600 mm x 500 mm

•        Max. scan range: (height x diameter) 290 mm x 400 mm

nanofocus x-ray tube

•        180 kV / 15 W

•        < 1 µm  resolution (for 2mm sample diameter) 

microfocus x-ray tube

•        240 kV / 320 W 

•        > 3 µm  resolution / transmission < 40 mm steel

 

Newsletter supplement:
05: X-RAY COMPUTED TOMOGRAPHY (X-CT)

Contact

Contact person

Christian Kapitza
BIAS
FZB / BIAS
Phone 218-58034
kapitza@bias.de
http://www.bias.de/industrie

Principal Investigator
Bergmann, Ralf
Updated by: MAPEX