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September 2021

Welcome Professor Björn Lüssem

We are very happy to welcome Prof. Björn Lüssem at IMSAS as professor for Microsystems Technology on 1 September 2021.

Björn Lüssem was Associate Professor at Kent State University in Kent, Ohio, US. The area of his research covers design and technology of flexible organic devices (e. g. organic electrochemical transistors and sensors) and processes to integrate these devices into larger sensor systems.

We wish him a  lot of success in Bremen!

 

Prof. Björn Lüssem

January 2020

Dr. Frieder Lucklum new head of CAMM (Electrical Engineering) at DTU in Copenhagen

Dr. Frieder Lucklum worked for six years as Postdoc at IMSAS. He succesfully built and did research on phononic crystals.  

Since 1 January 2020 he is head of the danish DTU Centre for Acoustic-Mechanical Micro Systems (CAMM)  http://www.camm.elektro.dtu.dk/

 

We wish him all the best for his new post!

October 2019

Pupils visit IMSAS

Technologiepark Bremen organizes tour for pupils at IMSAS cleanrooms.

SchülerInnen besuchen das IMSAS
Herbstpraktikum Technologiepark

2019 Publication

Prof. Walter Lang

Sensors and Measurement Systems

(River Publishers Series in Electronic Materials and Devices)

Sensors and Measurement Systems

August 2019

Poster Award of MME-Workshop in Oxford goes to Rico Tiedemann

Rico Tiedemann received one of three awards for a poster at the 30th Micromechanics and Microsystems Europe Workshop in Oxford (GB) .

Tiedeman does PhD research on the development and direct embedding of piezoresistive sensors in  aluminum cast . „Combination of thin-film strain gauge and thick-film insulation: A technology approach to fabricate an aluminum-based short term high temperature resistant strain gauge“  showed his latest research results.

MMS Oxford

April 2019

Monitoring dehumidifying of buildings damaged by water with an intelligent moisture-content measurement system

Different sensor technologies for measuring the moisture content in building materials will be evaluated, developed and tested. Sensor information will be used to monitor drying equipment after water-induced damages. Flooding repairs usually take several weeks and require large amounts of energy. Multiple checks by a technician might be necessary to determine when a sufficient drying state is achieved and the equipment can be switched off.

Baufeuchte

January 2019

DFG-ANR Project “Tubular Bell” Kick-Off in Bremen

The German-French cooperation project “Tubular Bell” aims at a new class of phononic crystals, Tubular Phononic Crystals, and their application as a sensor, the Tubular Bell. Our vision is a fundamentally new sensor concept for in-line monitoring of liquids in cylindrical structures like pipes (chemistry) or vessels (medicine). The DFG and ANR funded project brings together research groups from the Université Pierre et Marie Curie in Paris, Université de Lille, Otto-von-Guericke-University Magdeburg, and University of Bremen, with the Kick-Off meeting held on 16.01.2019 in Bremen.

 

Tubular Bell
M.J. Vellekoop, R. Lucklum, S. Hémon, F. Lucklum, N. Mukhin, Y. Pennec, B. Djafari Rouhani,M.J. (v.l.n.r.)

November 2018

Marcel Reimers receives IAV Talent Award for his Projektarbeit at IMSAS

AT the IAV Talent Innovation Day in Berlin the IAV Talent Award "Future Mobility" was awarded  to the The Projektarbeit of Marcel Reimers  „Temperature Monitoring of Lithium-Ion Cells with Printed Sensors for Automotive Battery Packs”  in the category "Projekt".  01.11.2018 .

 

 

Reimers
Die PreisträgerInnen (v.l.n.r.) - Dr. T. Steinbach, M. Reimers, K. Abe, Ch. G. Simonis, St. Josefs

November 2017

IMSAS presents new chip for 2-dimensional air-velocity measurement: Application during field test in cold storage warehouse

In many applications it is necessary to measure not only the magnitude, but also the angle of the air-velocity, e.g. for capturing the flow field in gaps or at surfaces. So far, two separate sensor chips were required to construct a 2-dimensional anemometer. The new IMSAS chip integrates 4 thermopiles placed with a small offset in ±x and ±y direction, close to a heater. Magnitude and angle can be calculated by the x and y difference signals. 

The first samples were processed in our clean room and put into service. The required chip area was reduced to 2mm by 2mm, i.e. only 60% of the initial 1-dimensional chip design. Now, only one square 2D chip is necessary instead of two 1D chips. In total, the required chip area was thereby reduced to one third. 

The new chip also enables more efficient housing and PCB designs. The sensor element can now be placed exactly in the center of the housing, resulting in an equal sensitivity in all four directions. 

The first test in our wind tunnel has shown that the new chip has a higher sensitivity at low velocities.  Nine Wireless Anemometers, equipped with the new 2D chip, were installed in a cold storage warehouse for apples during a field test in November 2017.

 

neuer 2D Chip
2D Chip