IMSAS uses a variety of facilities for research, development and production of state-of-the-art microsystems. Two large class ISO 6 cleanrooms with an overall area of 900 m² for front-end and back-end processing of 100 mm and 150 mm wafers are available, offering the complete range of standard MEMS processes: 


  • Contact-Lithography
  • Laser-Lithography
  • 3D-Lithography


Thermal Processing

  • Oxidation 
  • Diffusion 
  • Annealing
  • Parylene Coating



  • Low Pressure Chemical Vapour Deposition
  • Low pressure chemical vapor deposition  (LPCVD
  • Plasma Enhanced Chemical Vapor Deposition (PECVD
  • Sputtering
  • Evaporation



  • Wet Etching
  • Reactive Ion Etching (RIE)
  • Deep Reactive Ion Etching (DRIE) / Advanced Silicon Etching (ASE
  • Ion Milling Etching
  • Plasma etching (PE)


Electro Plating



  • Silicon Fusion Bonding (SFB) 
  • Anodic Bonding 
  • Eutectic Bonding 
  • Solder Bonding 
  • Glass-Frit Bonding

Chemisch-Mechanisches Polieren (CMP)


Assembly and Packaging Technology

IMSAS has a great variety of specialised equipment  to enable assembly and packaging technology at the ende of the MEMS production:

  • Waferdicing
  • Chipbonding
  • Wirebonding
  • (PCB) Processing


Test and Characterizing

For fabrication as well as for testing and characterization of MEMS (Micorelectromechanical Systems) devices IMSAS has a multitude of measuring instruments and stations:

  • Film-Thickness Measurement Tools
  • Step Height Prober
  • Surface Profiler
  • 3D Measurement System
  • Gauge for film stress
  • 4-Point Resistivity Prober
  • Scanning Electron Microscope (SEM)
  • X-Ray Fluorescence Spectrometer
  • Pressure Measuring Station
  • Flow Measuring Station
  • Gas Measuring Station
  • Climatic Exposure Test Cabinet
  • Impedance spectroskopy


Design und Simulation

Numerous design and simulation tools enable IMSAS to create and optimize MEMS designs in-house:

  • CoventorWare®
  • LabVIEW®
  • COMSOL Multiphysics®


back to research